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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA stencil for Samsung S7 (SM-G930F)

BGA stencil for Samsung S7 (SM-G930F)

5 (1)
BGA stencil for Samsung S7 (SM-G930F)
Price: 6,20 EUR w/o VAT

Quantity

ID: 21748

Product weight: 0.02 kg

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BGA stencil for Samsung S7 (SM-G930F) plaiting kit it's a BGA stencil matrix needed when you have to exchange BGA parts of your phone and wan't to apply BGA balls into IC.

Product weight: 0.02 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.61 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

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Sito lekko uszkodzone w jednym obszarze (wyglada na uszkodzenie fabryczne) na szczescie chyba ten fragment nie bedzie potrzebmy do naprawy. Sam sklep polecam.