Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > MEGA-IDEA Black Stencils MSM8953 8917 CPU for Redmi Note 4X|Redmi4|4A |5A|5Plus|S2 |Pro|MI5X|MAX 2
|
MEGA-IDEA Black Stencils MSM8953 8917 CPU for Redmi Note 4X|Redmi4|4A |5A|5Plus|S2 |Pro|MI5X|MAX 2
- Xiaomi Redmi Note 4X
- Xiaomi Redmi 4
- xiaomi redmi 4A
- Xiaomi Redmi 5A
- Xiaomi Redmi 5 Plus
- Xiaomi Redmi S2
- Xiaomi Redmi Pro
- Xiaomi Mi A1 (Mi 5X)
- Xiaomi Mi Max 2
- Place of Origin: China
- Brand Name: Mega Idea
- Model Number: Black Reballing Stencil
- Material: Steel
- Usage: Reballing
- Color: Black
- Weight: 25g
- Type: Black Stencil Series (For Android)
- Operating Temperature: -50~500C
|
NEGOTIATE PRICE
You might also be interested in:
+ |
MEGA- IDEA Black Stencils MTK MT Power
more
|
Price:
9.00 EUR w/o VAT |
+ |
AMAOE BGA Mbga-U20 stencil reballing CPU MT6779V MT6732/6752 MT6757V 0,12mm for MBGA-B7
more
|
Price:
7.00 EUR w/o VAT |
+ |
Stencil Direct BGA for eMMC 153/169
more
|
Price:
8.00 EUR w/o VAT |
+ |
Complete set of 49 pcs BGA stencils for uBGA
more
|
Price:
49.00 EUR w/o VAT |
+ |
MEGA-IDEA Black Stencils MTK CPU
more
|
Price:
9.00 EUR w/o VAT |
+ |
AMAOE BGA Mbga-MB1 stencil reballing BGA A14 Wifi Move Board 0,12mm
more
|
Price:
7.00 EUR w/o VAT |
+ |
AMAOE BGA Mbga-U42 stencil reballing BGA RAM556 0,12mm for MBGA-B16
more
|
Price:
7.00 EUR w/o VAT |
+ |
Stencil Direct BGA for eMMC 162
more
|
Price:
8.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.