Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611
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BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611
BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611 reballing stencil, template, matrix for Samsung Exynos RAM chip repair.
- Samsung Exynos RAM 5430
- Samsung Exynos RAM 7884/7885/7904
- Samsung Exynos RAM 9610
- Samsung Exynos RAM 8890
- Samsung Exynos RAM 7870/7880
- Samsung Exynos RAM 9611
- Country of Origin: China
- Name: CPU-0.15MM
- Material: steel
- Purpose: Reballing
- Weight: 25g
- Working temperature: -50~500C
- Grey colour
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
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