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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611

BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611

BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611
Price: 6,00 EUR w/o VAT

Quantity

ID: 22850

Product weight: 0.30 kg

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BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611 reballing stencil, template, matrix for Samsung Exynos RAM chip repair.

 
Supported Models:
  • Samsung Exynos RAM 5430
  • Samsung Exynos RAM 7884/7885/7904
  • Samsung Exynos RAM 9610
  • Samsung Exynos RAM 8890
  • Samsung Exynos RAM 7870/7880
  • Samsung Exynos RAM 9611
 
 
Specification:
  • Country of Origin: China
  • Name: CPU-0.15MM
  • Material: steel
  • Purpose: Reballing
  • Weight: 25g
  • Working temperature: -50~500C
  • Grey colour

Product weight: 0.30 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.56 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

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