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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611

BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611

BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611
Price: 6,00 EUR w/o VAT

Quantity

ID: 22850

Product weight: 0.30 kg

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BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611 reballing stencil, template, matrix for Samsung Exynos RAM chip repair.

 
Supported Models:
  • Samsung Exynos RAM 5430
  • Samsung Exynos RAM 7884/7885/7904
  • Samsung Exynos RAM 9610
  • Samsung Exynos RAM 8890
  • Samsung Exynos RAM 7870/7880
  • Samsung Exynos RAM 9611
 
 
Specification:
  • Country of Origin: China
  • Name: CPU-0.15MM
  • Material: steel
  • Purpose: Reballing
  • Weight: 25g
  • Working temperature: -50~500C
  • Grey colour

Product weight: 0.30 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 6.01 EUR

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1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

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