4,8 RATING:
Purchase satisfaction
94,7%
Customer service
94,0%
Shop offer
92,7%

Cart

0 products
Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA Mbga-U45 stencil reballing BGA CPU A14/A15/A16 0,12mm for MBGA-B12

AMAOE BGA Mbga-U45 stencil reballing BGA CPU A14/A15/A16 0,12mm for MBGA-B12

AMAOE BGA Mbga-U45 stencil reballing BGA CPU A14/A15/A16 0,12mm for MBGA-B12
Price: 7,00 EUR w/o VAT

Quantity

ID: 23027

Product weight: 0.20 kg

Add to store products

Ask for product

AMAOE BGA Mbga-U45 stencil reballing BGA CPU A14/A15/A16 0,12mm for MBGA-B12 - the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
 
Technical data:
Brand: AMAOE
Model: Mbga-U45
Supported chips CPU A14/A15/A16
THICKNESS: 0.12MM
 
Specification of screens/templates:
  • High-quality, hard steel sheet template
  • Precision laser cut for better alignment
  • High temperature resistant and not easy to deform
  • Processor and ICs are integrated in one template
  • IC numbers are laser marked on the template for reference purposes, making them much easier to find.

 

Contents:
1 pc. - Mbga screen/matrix/ stencil

 

Product weight: 0.20 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.74 EUR

NEGOTIATE PRICE

PDF
If you are interested in AMAOE BGA Mbga-U45 stencil reballing BGA CPU A14/A15/A16 0,12mm for MBGA-B12 you will probably want to take a look at following products:

You might also be interested in:

BGA reballing stencils JV-RMS + BGA reballing stencils JV-RMS more
Price:
109.00 EUR w/o VAT
MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2 + MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2 more
Price:
9.00 EUR w/o VAT
Direct BGA 9in1 stencils for BGA 136/152/272/63/132/100/316 and LGA 60/52 + Direct BGA 9in1 stencils for BGA 136/152/272/63/132/100/316 and LGA 60/52 more
Price:
25.00 EUR w/o VAT
MEGA-IDEA Black Stencils Kirin 970 HT3670 CPU for HUAWEI P20|20Pro |Mate10|Pro|HONOR 10|V10 + MEGA-IDEA Black Stencils Kirin 970 HT3670 CPU for HUAWEI P20|20Pro |Mate10|Pro|HONOR 10|V10 more
Price:
18.00 EUR w/o VAT
AMAOE BGA Mbga-U24 stencil reballing CPU HI3680 HI3660 HI3670v 0,12mm for MBGA-B9 + AMAOE BGA Mbga-U24 stencil reballing CPU HI3680 HI3660 HI3670v 0,12mm for MBGA-B9 more
Price:
7.00 EUR w/o VAT
MEGA-IDEA Black Stencils MSM8996 CPU for Galaxy S7 Series|G9300/9350/9308 + MEGA-IDEA Black Stencils MSM8996 CPU for Galaxy S7 Series|G9300/9350/9308 more
Price:
9.00 EUR w/o VAT
AMAOE BGA Mbga-U34 stencil reballing BGA Exynos CPU 9609 7885RAM 880/980 0,12mm for MBGA-B14 + AMAOE BGA Mbga-U34 stencil reballing BGA Exynos CPU 9609 7885RAM 880/980 0,12mm for MBGA-B14 more
Price:
7.00 EUR w/o VAT
TWTK-BGAP-VIP18 Nokia plaiting kit + TWTK-BGAP-VIP18 Nokia plaiting kit more
Price:
8.00 EUR w/o VAT

Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.