Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > MEGA-IDEA Black Stencils MSM8953 MT6797 CPU For Redmi Note 4 | 4X | Redmi Pro
|
MEGA-IDEA Black Stencils MSM8953 MT6797 CPU For Redmi Note 4 | 4X | Redmi Pro
- xiaomi Redmi Note 4
- xiaomi Redmi 4X
- xiaomi Redmi Pro
- Place of Origin: China
- Brand Name: Mega Idea
- Model Number: Black Reballing Stencil
- Material: Steel
- Usage: Reballing
- Color: Black
- Weight: 25g
- Type: Black Stencil Series (For Android)
- Operating Temperature: -50~500C
|
NEGOTIATE PRICE
You might also be interested in:
+ |
BGA stencils Kirin 950 / 955 / HI3650 CPU (HW:3) 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+ |
MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X
more
|
Price:
18.00 EUR w/o VAT |
+ |
AMAOE BGA stencil reballing Mbga-U3
more
|
Price:
7.00 EUR w/o VAT |
+ |
BGA Plate Nokia N97/N85/N82 plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+ |
TWTK-BGAP-Nokia N95 plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+ |
BGA stencils for Maxim MAX Power (MAX: 1) 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+ |
BGA stencils for MTK CPU (MU: 1) 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+ |
MEGA-IDEA Black Stencils Qualcom Snapdragon 636/660 CPU for Xiaomi Redmi NOTE5|NOTE5PRO|MI NOTE 3|6X
more
|
Price:
9.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.