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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA EMMC V2.0 stencil reballing BGA EMMC/LPDDR/NAND/PCIE 0,15mm

AMAOE BGA EMMC V2.0 stencil reballing BGA EMMC/LPDDR/NAND/PCIE 0,15mm

Price: 10,00 EUR w/o VAT

Quantity

Available amount: 10

ID: 23106

Product weight: 0.10 kg

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AMAOE BGA EMMC V2.0 stencil reballing BGA EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCIE 0,15mm the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

Technical data:

Brand: AMAOE

Model: EMMC: 3 V2.0

Supported chips: BGA153/169 BGA162 BGA221 BGA254 BGA315 BGA297 BGA178 BGA200 BGA110 BGA60 BGA70

THICKNESS: 0.15MM

Specification of screens/templates:

High-quality, hard steel sheet template
Precision laser cut for better alignment
High temperature resistant and not easy to deform
Processor and ICs are integrated in one template
IC numbers are laser marked on the template for reference purposes, making them much easier to find.

Contents:

1 pc. - Mbga screen/matrix/ stencil

Product weight: 0.10 kg.

Country:

Courier:

Delivery time: 14-28 working days from shiping date

Shipping cost: 9.75 EUR

NEGOTIATE PRICE

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.

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AMAOE BGA EMMC V2.0 stencil reballing BGA EMMC/LPDDR/NAND/PCIE 0,15mm

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