Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA EMMC V2.0 stencil reballing BGA EMMC/LPDDR/NAND/PCIE 0,15mm
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AMAOE BGA EMMC V2.0 stencil reballing BGA EMMC/LPDDR/NAND/PCIE 0,15mm
AMAOE BGA EMMC V2.0 stencil reballing BGA EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCIE 0,15mm the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
- High-quality, hard steel sheet template
- Precision laser cut for better alignment
- High temperature resistant and not easy to deform
- Processor and ICs are integrated in one template
- IC numbers are laser marked on the template for reference purposes, making them much easier to find.
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NEGOTIATE PRICE
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
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