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Main page > Workshop Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA EMMC V2.0 stencil reballing BGA EMMC/LPDDR/NAND/PCIE 0,15mm

AMAOE BGA EMMC V2.0 stencil reballing BGA EMMC/LPDDR/NAND/PCIE 0,15mm

AMAOE BGA EMMC V2.0 stencil reballing BGA EMMC/LPDDR/NAND/PCIE  0,15mm
Price: 10,00 EUR w/o VAT

Quantity

Available amount: 10

ID: 23106

Product weight: 0.10 kg

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AMAOE BGA EMMC V2.0 stencil reballing BGA EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCIE  0,15mm the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.

Technical data:
Brand: AMAOE
Model:  EMMC: 3  V2.0
Supported chips: BGA153/169 BGA162 BGA221 BGA254 BGA315 BGA297 BGA178 BGA200 BGA110 BGA60 BGA70
THICKNESS: 0.15MM
 
Specification of screens/templates:
  • High-quality, hard steel sheet template
  • Precision laser cut for better alignment
  • High temperature resistant and not easy to deform
  • Processor and ICs are integrated in one template
  • IC numbers are laser marked on the template for reference purposes, making them much easier to find.
Contents:
1 pc. - Mbga screen/matrix/ stencil



 

 

Product weight: 0.10 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.91 EUR

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1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

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