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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > TWTK-BGAP-40 in 1 for Nokia plaiting kit

TWTK-BGAP-40 in 1 for Nokia plaiting kit

TWTK-BGAP-40 in 1 for Nokia plaiting kit
Price: 8,00 EUR w/o VAT

Quantity

ID: 4296

Product weight: 0.02 kg

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TWTK-BGAP-40 in 1 for Nokia plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

Models:
6270,8810,2301 MF,3220 CPU,7610 CPU,7610/7260 UEM,3310/8210 CPU,3220 FLASH7200/2600 CPU,8800 CPU,7650 RAM,3100 CPU,7650 CPU,8310 UEM,N70 CPU,9500 CPU,6230 CPU,6210 FLASH,3310 MF,8210 UEM,3210/8210 CHARGE IC,6030 UEM,9500 UEM,7200/7250 FLASH,3220 MF,6230 RAM,N70,6230 UEM,6270,7260 CPU,8210 FLASH,8800 FLASH,6630 UEM,7250 CPU,8310/6230 FLASH,3310/3210 UEM,6230 MF,3310/3210 FLASH,6230 BT

Photo of kit:
Product weight: 0.02 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.62 EUR

NEGOTIATE PRICE

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If you are interested in TWTK-BGAP-40 in 1 for Nokia plaiting kit you will probably want to take a look at following products:

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.