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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > TWTK-BGAP-41 in 1 Samsung plaiting kit

TWTK-BGAP-41 in 1 Samsung plaiting kit

TWTK-BGAP-41 in 1 Samsung plaiting kit
Price: 8,00 EUR w/o VAT

Quantity

ID: 4294

Product weight: 0.02 kg

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TWTK-BGAP-41 in 1 Samsung plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

Models:
N188/N288 CPU,E800 CPU,S3C5410,S308 CPU,D500/D508 UEM,E630 CPU,V200 CPU,A760 CPU,6030 UEM,K700 UEM,600/800 FLASH,L7-IC2,L7-IC1,0V2640,0V7649,0V7670,0V7660,P800 FLASH,V66/V60 CPU,T618 RF,AIT800G,D508 VIDEOTAPE,E700 POWER IC,X600 POWER IC,V208 VIDEOTAPE,D500 VIDEOTAPE,E708 FLASH,600/800 FLASH,S308 AF,E700 CPU,D500/508 FLASH,E708 CPU

Photo of kit:
Product weight: 0.02 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.73 EUR

NEGOTIATE PRICE

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If you are interested in TWTK-BGAP-41 in 1 Samsung plaiting kit you will probably want to take a look at following products:

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.