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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > TWTK-BGAP-30 in 1 SE plaiting kit
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TWTK-BGAP-30 in 1 SE plaiting kit
TWTK-BGAP-30 in 1 SE plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.
Models:
T618 CPU,T618,T618 RF,T618 RAM,T618 UEM,T618 VIDEOTAPE,T618 CHARGE IC,T628 CPU,P800 RAM,P800 FLASH,K810 FLASH,K810 CPU,K750 UEM,K790 MF,K790 CPU,K700 UEM,K700 CPU,K700 AF,K700 FLASH,CDMA,V66,IC,MT6318,MT3301,OV7649,OV9653
Photo of kit:
Models:
T618 CPU,T618,T618 RF,T618 RAM,T618 UEM,T618 VIDEOTAPE,T618 CHARGE IC,T628 CPU,P800 RAM,P800 FLASH,K810 FLASH,K810 CPU,K750 UEM,K790 MF,K790 CPU,K700 UEM,K700 CPU,K700 AF,K700 FLASH,CDMA,V66,IC,MT6318,MT3301,OV7649,OV9653
Photo of kit:
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NEGOTIATE PRICE
If you are interested in
TWTK-BGAP-30 in 1 SE plaiting kit
you will probably want to take a look at following products:
See also
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
