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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > TWTK-BGAP-VIP88 MTK plaiting kit

TWTK-BGAP-VIP88 MTK plaiting kit

TWTK-BGAP-VIP88 MTK plaiting kit
Price: 8,00 EUR w/o VAT

Quantity

ID: 4297

Product weight: 0.02 kg

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TWTK-BGAP-VIP88 MTK plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

Models:
V70,6226 CPU,6219 CPU,6217 CPU,6218 CPU,6228 CPU,6205 CPU,6225 CPU,6680,V300 CPU,6188 CPU,6210 FLASH,6230 MF,6600 CPU,6230 RAM,IC,SC6600 CPU,IC3,IC8,IC11,6230 CPU,IC,OV9653,6070,N95 CPU,IC2,IC1,N95UEM

Photo of kit:
Product weight: 0.02 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.61 EUR

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If you are interested in TWTK-BGAP-VIP88 MTK plaiting kit you will probably want to take a look at following products:

See also

AOYUE RB910 BGA reballing kit + AOYUE RB910 BGA reballing kit more
Price:
149.00 EUR w/o VAT
Reballing Kit Jovy - JV-RMS + Reballing Kit Jovy - JV-RMS more
Price:
359.00 EUR w/o VAT

Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.