24 stainless paiting ball for making IC Tin ball

Price: 10,41 EUR w/o VAT

Quantity

ID: 658

Product weight: 0.01 kg

Add to store products

Ask for product

Product description
Delivery cost calculator
Wholesale orders
Files to download

24 stainless paiting ball for making IC Tin ball is a needed tool when you have to exchange BGA parts of your phone.

List of chipset supported:

- 10x10 BGA Platform for power supply IC of Motorola V998/V3688
- 80PIN BGA Platform for IF IC of NOKIA 3310
- Platform for the Font database IC of Motorola V66
- 108PIN BGA Platfrom of CPU of Panasonic GD90
- Platform for the power supply IC and Audio IC of NOKIA 3210
- 72PIN BGA Platform for Font database IC of Samsung A188
- Platform for IF IC of Motorola V998/V3688 and power supply IC of Motorola L2000
- 71PING BGA Platform for Font database IC of Panasonic GD90 (Small)
- 71PING BGA Platform for Font database IC of Panasonic GD90 (Big)
- Platform for CPU of NOKIA 3210 and Samsung 2400
- Platform for Font database Flash IC of Samsung phone
- Platform for charging IC of NOKIA 3210/8810
- Platform for Font database IC of Motorola V998/V3688/L2000
- 36PIN BGA platform for RAM of Motorola T2688
- 16PIN BGA platform for Motorola V998/V3688
- 46PIN BGA Platform for Font database IC of Ericsson T18/T28
- Platform for Font database Flash IC OF Motorla V998/V3688/cd928
- Platform for RAM of Motorola cd928/V998/V3688/L2000 and NOKIA 8810
- 175PIN BGA Platform for CPU of 702
- 179PIN BGA Platform for CPU of Motorola V998/V3688
- 160PIN BGA Platform for CPU of SIEMENS C25
- 132PIN BGA Platform for CPU of Ericsson T28
- 200PIN BGA Platform for CPU of SIEMENS C35
- 176PIN BGA Platform for CPU of NOKIA 8810

Warranty

This product has 12 months warranty.

Product weight: 0.01 kg.

Country:

Courier:

Delivery time: 14-28 working days from shiping date

Shipping cost: 9.56 EUR

NEGOTIATE PRICE

If you are interested in 24 stainless paiting ball for making IC Tin ball you will probably want to take a look at following products:

This product was bought most often with:

+	PANA GD55 v2.0,v3.0 more	Price: 4.00 EUR w/o VAT
+	Cable SIEM C55/S55 v2.0, v3.0 more	Price: 4.46 EUR w/o VAT
+	Planting kit BTP3 for BGA IC/SMD parts more	Price: 63.54 EUR w/o VAT
+	Optional nozzles for NET station more	Price: 16.79 EUR w/o VAT
+	SEN S200/P200 v2.0, v3.0 cable more	Price: 8.29 EUR w/o VAT
+	Cable SAM R2xx/A300/A400 UNLOCK v2.0,v3.0 more	Price: 4.60 EUR w/o VAT
+	ALCA BG 525/332/331/526 v2.0, v3.0 more	Price: 6.59 EUR w/o VAT

Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.

Repair Equipment Select subcategory

+	Planting kit BTP3 for BGA IC/SMD parts more	Price: 63.54 EUR w/o VAT
+	BGA Planting Kit for Siemens series x65, x7x more	Price: 14.00 EUR w/o VAT

24 stainless paiting ball for making IC Tin ball

Warranty

See also

This product was bought most often with:

Note

Join Us