Main page > Repair Equipment > Soldering Equipment > Stencils sets for BGA > Planting kit BTP3 for BGA IC/SMD parts
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Planting kit BTP3 for BGA IC/SMD parts
Package contains:
- 18 position IC modules for SMD, BGA component place tin/soldering ball for mobile phones
- 28 stainless paiting ball for making IC Tin ball
- solderign platform
- discharge smoke fun
- soldering kit
- instruction and warranty
Warranty
This product has 12 months warranty.
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NEGOTIATE PRICE
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.