Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm
|
BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm
|
NEGOTIATE PRICE
You might also be interested in:
+ |
BGA stencil for iPhone 4 (P3001)
more
|
Price:
6.00 EUR w/o VAT |
+ |
BGA stencil for Samsung Galaxy S5 (SM-G900F)
more
|
Price:
6.20 EUR w/o VAT |
+ |
BGA stencil for Samsung S7 (SM-G930F)
more
|
Price:
6.20 EUR w/o VAT |
+ |
BGA stencils HI6620 (HW:5) 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+ |
BGA stencil for iPhone 6S Plus (P3040)
more
|
Price:
7.00 EUR w/o VAT |
+ |
TWTK-BGAP-40 in 1 for Nokia plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+ |
MEGA-IDEA Black Stencils MSM8953 8917 CPU for Redmi Note 4X|Redmi4|4A |5A|5Plus|S2 |Pro|MI5X|MAX 2
more
|
Price:
9.00 EUR w/o VAT |
+ |
TWTK-BGAP-20 in 1 for SE plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.