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Main page > Workshop Equipment > Soldering Equipment > Stencil BGA kit > BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm

BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm

BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm
Price: 12,00 EUR w/o VAT

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ID: 22173

Product weight: 0.01 kg

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BGA stencils for Huawei HISilicon CPU (HU: 2) 0.12mm allow you to reball 6 models: HI6520, HI3660B, HI6220, HI6250, HI3660A, HI6622.

Product weight: 0.01 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.90 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

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