Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > MEGA-IDEA Black Stencils MSM8956 MT6795 CPU for Redmi Note 2 |3| MI MAX
|
MEGA-IDEA Black Stencils MSM8956 MT6795 CPU for Redmi Note 2 |3| MI MAX
- Xiaomi Redmi Note 2
- Xiaomi Redmi Note 3
- Xiaomi Mi Max
- Place of Origin: China
- Brand Name: Mega Idea
- Model Number: Black Reballing Stencil
- Material: Steel
- Usage: Reballing
- Color: Black
- Weight: 25g
- Type: Black Stencil Series (For Android)
- Operating Temperature: -50~500C
|
NEGOTIATE PRICE
You might also be interested in:
+ |
BGA Plate Nokia 09 new model plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+ |
AMAOE BGA Mbga-MY1 stencil reballing BGA EMMC/EMCP/UFS BGA153 BGA162 BGA221 BGA254 0,15mm
more
|
Price:
7.00 EUR w/o VAT |
+ |
TWTK-BGAP-40 in 1 for Nokia plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+ |
AMAOE BGA Mbga-DR1 stencil reballing BGA200 4in1 0,15mm
more
|
Price:
7.00 EUR w/o VAT |
+ |
MEGA-IDEA Black Stencils MT6755V/6750V CPU For Oppo R9/A59/A37/Vivo Y67,Noblue 5/3/3S/6
more
|
Price:
9.00 EUR w/o VAT |
+ |
AMAOE Mbga-U19 sita matryca do reballingu BGA MT6785V MT6735/6737/6753 MT6750/6755 0,12mm dla MBGA-B7
more
|
Price:
7.00 EUR w/o VAT |
+ |
BGAP for SonyEricsson PDA plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+ |
Stencil Direct BGA for eMMC 162
more
|
Price:
8.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.