|
Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9
|
 |
MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9
MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9 - is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional. With multiple polish and test, all series of reballing tools for apple and adroid phone chips finally come out.
Compatible Models:
- HUAWEI P10
- HUAWEI 10 Plus
- HUAWEI Mate 9
- HUAWEI 9 Pro
- HUAWEI nova 2S
- HUAWEI HONOR 9
- HUAWEI V9
Specyfication:
- Place of Origin: China
- Brand Name: Mega Idea
- Model Number: Black Reballing Stencil
- Material: Steel
- Usage: Reballing
- Color: Black
- Weight: 25g
- Type: Black Stencil Series (For Android)
- Operating Temperature: -50~500C
|
||
NEGOTIATE PRICE
If you are interested in
MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9
you will probably want to take a look at following products:
You might also be interested in:
+
|
TWTK-BGAP-NKI SPE plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga-U35 stencil reballing BGA CPU Exynos 8895 Exynos7580 Exynos8895RAM 0,12mm for MBGA-B14
more
|
Price:
7.00 EUR w/o VAT |
+
|
TWTK-BGAP-58 in 1 for Nokia plaiting kit
more
|
Price:
8.00 EUR w/o VAT |
+
|
BGA TWTK-BGAP-11 plaiting kit
more
|
Price:
9.80 EUR w/o VAT |
+
|
BGA reballing stencil EU4v2.0 for Samsung Exynos RAM5430/7884/7885, 7904/9610/8890, 7870/7880/9611
more
|
Price:
6.00 EUR w/o VAT |
+
|
MEGA-IDEA Black Stencils MSM8916 8928 MT6952 CPU For Redmi NOTE | Redmi 2 |2A
more
|
Price:
9.00 EUR w/o VAT |
| + |
AMAOE BGA Mbga-U32 stencil reballing BGA A14/A15CPU 0,12mm for MBGA-B12
more
|
Price:
7.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga-U15 stencil reballing BGA SM7150 MT6797W MT6739V 0,12mm for MBGA-B6
more
|
Price:
7.00 EUR w/o VAT |
This product was bought most often with:
+
|
MEGA-IDEA Black Stencils Kirin 970 HT3670 CPU for HUAWEI P20|20Pro |Mate10|Pro|HONOR 10|V10
more
|
Price:
18.00 EUR w/o VAT |
+
|
Silicone protective Magicpad for iPhone CPU BGA fingerprint repair
more
|
Price:
8.00 EUR w/o VAT |
+
|
MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2
more
|
Price:
9.00 EUR w/o VAT |
+
|
BGA stencils for Huawei HI Power 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+
|
EMMC Dongle
more
|
Price:
79.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
