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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9

MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9

MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9
Price: 9,00 EUR w/o VAT

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ID: 22478

Product weight: 0.20 kg

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MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9  - is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils.  great ordinarity. economic but functional. With multiple polish and test, all series of reballing tools for apple and adroid phone chips finally come out.
 
Compatible Models:
  • HUAWEI P10 
  • HUAWEI 10 Plus
  • HUAWEI Mate 9
  • HUAWEI 9 Pro 
  • HUAWEI nova 2S
  • HUAWEI HONOR 9 
  • HUAWEI V9
 
Specyfication:
  • Place of Origin: China
  • Brand Name: Mega Idea
  • Model Number: Black Reballing Stencil
  • Material: Steel
  • Usage: Reballing
  • Color: Black
  • Weight: 25g
  • Type: Black Stencil Series (For Android)
  • Operating Temperature: -50~500C

 

 

 

 

 

 

 

Product weight: 0.20 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.56 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

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