4,8 RATING:
Purchase satisfaction
94,7%
Customer service
94,0%
Shop offer
92,7%

Cart

0 products
Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2

MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2

MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2
Price: 9,00 EUR w/o VAT

Quantity

Available amount: 1

ID: 22471

Product weight: 0.20 kg

Add to store products

Ask for product

MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI 8 | MIX 2 - is born for reballing tin balls, bring you unique using experience, making every tin ball round and full.
Proffesional builder of black reballing stencils.  great ordinarity. economic but functional. With multiple polish and test, all series of reballing tools for apple and adroid phone chips finally come out.
 
Compatible Models:
  • XIAOMI MI 8 
  • XIAOMI MI MIX 2
 
Specyfication:
  • Place of Origin: China
  • Brand Name: Mega Idea
  • Model Number: Black Reballing Stencil
  • Material: Steel
  • Usage: Reballing
  • Color: Black
  • Weight: 25g
  • Type: Black Stencil Series (For Android)
  • Operating Temperature: -50~500C

 

 

 

 

Product weight: 0.20 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.56 EUR

NEGOTIATE PRICE

PDF
If you are interested in MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2 you will probably want to take a look at following products:

You might also be interested in:

BGA TWTK-BGAP-25 plaiting kit + BGA TWTK-BGAP-25 plaiting kit more
Price:
9.00 EUR w/o VAT
MEGA-IDEA Black Stencils MSM8953 MT6797 CPU For Redmi Note 4 | 4X | Redmi Pro + MEGA-IDEA Black Stencils MSM8953 MT6797 CPU For Redmi Note 4 | 4X | Redmi Pro more
Price:
9.00 EUR w/o VAT
AMAOE BGA Mbga-U31 stencil reballing BGA A14/A15CPU 0,12mm for MBGA-B12 + AMAOE BGA Mbga-U31 stencil reballing BGA A14/A15CPU 0,12mm for MBGA-B12 more
Price:
7.00 EUR w/o VAT
AMAOE BGA Mbga-U22 stencil reballing CPU SM7250 MSM8952 SM7350 0,12mm for MBGA-B8 + AMAOE BGA Mbga-U22 stencil reballing CPU SM7250 MSM8952 SM7350 0,12mm for MBGA-B8 more
Price:
7.00 EUR w/o VAT
TWTK-BGAP A Sieries plaiting kit + TWTK-BGAP A Sieries plaiting kit more
Price:
8.00 EUR w/o VAT
MEGA-IDEA Black Stencils MSM8996 CPU for XIAOMI 5,5S,5sPlus,Note2,MIX + MEGA-IDEA Black Stencils MSM8996 CPU for XIAOMI 5,5S,5sPlus,Note2,MIX more
Price:
9.00 EUR w/o VAT
Stencil Direct BGA for eMMC 529 + Stencil Direct BGA for eMMC 529 more
Price:
8.00 EUR w/o VAT
AMAOE BGA Mbga-U25 stencil reballing CPU HI3690v1 RAM366 RAM376 0,12mm for MBGA-B9 + AMAOE BGA Mbga-U25 stencil reballing CPU HI3690v1 RAM366 RAM376 0,12mm for MBGA-B9 more
Price:
7.00 EUR w/o VAT

Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.