|
Main page > Workshop Equipment > Soldering Equipment > Stencil BGA kit > MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2
|
 |
MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2
MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI 8 | MIX 2 - is born for reballing tin balls, bring you unique using experience, making every tin ball round and full.
Proffesional builder of black reballing stencils. great ordinarity. economic but functional. With multiple polish and test, all series of reballing tools for apple and adroid phone chips finally come out.
Compatible Models:
- XIAOMI MI 8
- XIAOMI MI MIX 2
Specyfication:
- Place of Origin: China
- Brand Name: Mega Idea
- Model Number: Black Reballing Stencil
- Material: Steel
- Usage: Reballing
- Color: Black
- Weight: 25g
- Type: Black Stencil Series (For Android)
- Operating Temperature: -50~500C
|
||
NEGOTIATE PRICE
If you are interested in
MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2
you will probably want to take a look at following products:
You might also be interested in:
+
|
AMAOE BGA Mbga-U37 stencil reballing BGA CPU Exynos 1080/9815 Exynos3475 Exynos8890 0,12mm for MBGA-B14
more
|
Price:
7.00 EUR w/o VAT |
| + |
AMAOE BGA Mbga-U30 stencil reballing BGA CPU A14 0,12mm for MBGA-B11
more
|
Price:
7.00 EUR w/o VAT |
+
|
MEGA-IDEA Black Stencils MSM8953 MT6797 CPU For Redmi Note 4 | 4X | Redmi Pro
more
|
Price:
9.00 EUR w/o VAT |
+
|
MEGA-IDEA Black Stencils MSM8953 8917 CPU for Redmi Note 4X|Redmi4|4A |5A|5Plus|S2 |Pro|MI5X|MAX 2
more
|
Price:
9.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga-U28 stencil reballing CPU HI6260v100 HI3630/3635 HI6260v101 0,12mm for MBGA-B10
more
|
Price:
7.00 EUR w/o VAT |
+
|
BGA stencil for Samsung Note 5 (N920)
more
|
Price:
6.20 EUR w/o VAT |
+
|
BGA stencil for iPhone 5S (P3025)
more
|
Price:
6.00 EUR w/o VAT |
+
|
MEGA-IDEA Black Stencils MTK CPU
more
|
Price:
9.00 EUR w/o VAT |
This product was bought most often with:
+
|
Silicone protective Magicpad for iPhone CPU BGA fingerprint repair
more
|
Price:
8.00 EUR w/o VAT |
+
|
MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9
more
|
Price:
9.00 EUR w/o VAT |
+
|
MEGA-IDEA Black Stencils Kirin 970 HT3670 CPU for HUAWEI P20|20Pro |Mate10|Pro|HONOR 10|V10
more
|
Price:
18.00 EUR w/o VAT |
+
|
BGA stencils for Huawei HI Power 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+
|
Small Power IC For Samsung Galaxy S9 / S9 Plus / Note 8 / Note 9 PM8005
more
|
Price:
7.72 EUR w/o VAT |
+
|
MaAnt Face Lattice Dot Matrix Repair Fixture MR-01
more
|
Price:
25.00 EUR w/o VAT |
+
|
Reballing stencil for MSM 8953 B01AB - QianLi 3D iBlack
more
|
Price:
9.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
