|
Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > MEGA-IDEA Black Stencils Kirin 970 HT3670 CPU for HUAWEI P20|20Pro |Mate10|Pro|HONOR 10|V10
|
 |
MEGA-IDEA Black Stencils Kirin 970 HT3670 CPU for HUAWEI P20|20Pro |Mate10|Pro|HONOR 10|V10
MEGA-IDEA Black Stencils Kirin 970 HT3670 CPU for HUAWEI P20|20Pro |Mate10|Pro|HONOR 10|V10 - is born for reballing tin balls, bring you unique using experience, making every tin ball round and full. Proffesional builder of black reballing stencils. great ordinarity. economic but functional. With multiple polish and test, all series of reballing tools for apple and adroid phone chips finally come out.
Compatible Models:
- HUAWEI P20
- HUAWEI 20 Pro
- HUAWEI Mate10/
- HUAWEI Mate 10 Pro
- HUAWEI HONOR 10
- HUAWEI HONOR V10
Specyfication:
- Place of Origin: China
- Brand Name: Mega Idea
- Model Number: Black Reballing Stencil
- Material: Steel
- Usage: Reballing
- Color: Black
- Weight: 25g
- Type: Black Stencil Series (For Android)
- Operating Temperature: -50~500C
|
||
NEGOTIATE PRICE
If you are interested in
MEGA-IDEA Black Stencils Kirin 970 HT3670 CPU for HUAWEI P20|20Pro |Mate10|Pro|HONOR 10|V10
you will probably want to take a look at following products:
You might also be interested in:
+
|
MEGA-IDEA Black Stencils MSM8916 8939 8940 CPU For OPPO VIVO
more
|
Price:
9.00 EUR w/o VAT |
+
|
MEGA-IDEA Black Stencils MSM8916 8928 MT6952 CPU For Redmi NOTE | Redmi 2 |2A
more
|
Price:
9.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga stencil reballing BGA M-SM8150 3in1 0,12mm
more
|
Price:
7.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga-U21 stencil reballing CPU MT6873V MT6758V MT6853V 0,12mm for MBGA-B7
more
|
Price:
7.00 EUR w/o VAT |
+
|
MEGA- IDEA Black Stencils Qualcom CPU MSM8928 A B |MSM660 |MSM8612 |MSM7225A |MSM8909 |MSM8952 |MSM8940
more
|
Price:
9.00 EUR w/o VAT |
+
|
BGA stencil for iPhone 6S Plus (P3040)
more
|
Price:
7.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga-U26 stencil reballing CPU HI3650 HI36A0 0,12mm for MBGA-B9
more
|
Price:
7.00 EUR w/o VAT |
+
|
AMAOE BGA Mbga-U17 stencil reballing Mbga-U17 SM7125 MT6595 MT6763v 0,12mm for MBGA-B6
more
|
Price:
7.00 EUR w/o VAT |
This product was bought most often with:
+
|
MEGA-IDEA black stencils Kirin 960 HT3660 CPU dla HUAWEI P10 |10+|Mate 9|9Pro |nova 2S|HONOR 9 |V9
more
|
Price:
9.00 EUR w/o VAT |
+
|
Silicone protective Magicpad for iPhone CPU BGA fingerprint repair
more
|
Price:
8.00 EUR w/o VAT |
+
|
MEGA-IDEA Black Stencils Qualcom Snapdragon SDM845 CPU For XIAOMI MI8 MIX2
more
|
Price:
9.00 EUR w/o VAT |
+
|
BGA stencils for Huawei HI Power 0.12mm
more
|
Price:
12.00 EUR w/o VAT |
+
|
EMMC Dongle
more
|
Price:
79.00 EUR w/o VAT |
+
|
BEST BST-69A double-sided metal scalpel for repairs BGA SMD CPU GPU MPU
more
|
Price:
7.90 EUR w/o VAT |
+
|
Eleks Maker platform
more
|
Price:
32.00 EUR w/o VAT |
Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
