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Main page > Repair Equipment > Soldering Equipment > Stencils sets for BGA > Universal tin planting and glue removal platform with 43pcs stencils for CPU reballing
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Universal tin planting and glue removal platform with 43pcs stencils for CPU reballing
Universal tin planting and glue removal platform with 43pcs stencils for CPU reballing designed for removing glue or planting tin. High-quality universal platform containing 43 reballing templates - magnetically attached. Helpful in tinning/de-adhesive of iPhone/Font/Qualcomm/Hisilicon/MediaTek CPU series ICs.
Functions:
1. This tool is a universal pewter planting and glue removal platform.
2. Resistant to high temperatures
3. Planting precisely
4. Comes with 43pcs CPU for reballing
Screens/templates specification:
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Apple CPU: A8,A9,A10,A11,A12,A13,A14,A15
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HiSilion CPU: 710,810,960,970,980,985/820,990,KIRIN9000
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Qualcomm CPU: Snapdragon 888, 845,855, 865 (small), 865 (large), 8gen1,778,765g. MSM8937/8940, MSM8909/8905, SDM636/660, SMG115, MSM8996, MT6762V, MSM8917, MSM8916/8939,8953IAB
- Fonts: 134,153,162,178,221,254
The package includes:
- platform + 43pcs cup reablling nets
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
