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Main page > Workshop Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA Mbga-U33 stencil reballing BGA CPU Exynos 9610/9611 7884/7885 7904 9610/11 0,12mm for MBGA-B14
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AMAOE BGA Mbga-U33 stencil reballing BGA CPU Exynos 9610/9611 7884/7885 7904 9610/11 0,12mm for MBGA-B14
AMAOE BGA Mbga-U33 stencil reballing BGA CPU Exynos 9610/9611 7884/7885 7904 9610/11 0,12mm for MBGA-B14- the sieves are a product made of steel resistant to high temperatures and deformations. Precise laser-cut templates facilitate positioning during work.
Technical data:
Brand: AMAOE
Model: Mbga-U33
Supported chips:CPU Exynos 9610/9611 7884/7885 7904 9610/11
THICKNESS: 0.12MM
Specification of screens/templates:
- High-quality, hard steel sheet template
- Precision laser cut for better alignment
- High temperature resistant and not easy to deform
- Processor and ICs are integrated in one template
- IC numbers are laser marked on the template for reference purposes, making them much easier to find.
Contents:
1 pc. - Mbga screen/matrix/ stencil
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NEGOTIATE PRICE
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AMAOE BGA Mbga-U33 stencil reballing BGA CPU Exynos 9610/9611 7884/7885 7904 9610/11 0,12mm for MBGA-B14
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
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