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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > TWTK-BGAP-30 in 1 SE plaiting kit

TWTK-BGAP-30 in 1 SE plaiting kit

TWTK-BGAP-30 in 1 SE plaiting kit
Price: 8,00 EUR w/o VAT

Quantity

ID: 4292

Product weight: 0.02 kg

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TWTK-BGAP-30 in 1 SE plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

Models:
T618 CPU,T618,T618 RF,T618 RAM,T618 UEM,T618 VIDEOTAPE,T618 CHARGE IC,T628 CPU,P800 RAM,P800 FLASH,K810 FLASH,K810 CPU,K750 UEM,K790 MF,K790 CPU,K700 UEM,K700 CPU,K700 AF,K700 FLASH,CDMA,V66,IC,MT6318,MT3301,OV7649,OV9653

Photo of kit:
Product weight: 0.02 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.61 EUR

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If you are interested in TWTK-BGAP-30 in 1 SE plaiting kit you will probably want to take a look at following products:

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.