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Main page > Repair Equipment > Soldering Equipment > BGA Rework system with LCD / Split Vision > Automatic WISDOMSHOW WDS-750 6800W BGA soldering station

Automatic WISDOMSHOW WDS-750 6800W BGA soldering station

Automatic WISDOMSHOW WDS-750 6800W BGA soldering station
Price: 7929,00 EUR w/o VAT
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ID: 22281

Product weight: 130.00 kg

Automatic WISDOMSHOW WDS-750 6800W BGA soldering station - designed for high performance electronics. It is a professional and modern solution for disassembly and assembly of BGA, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA systems and work with large multilayer PCBs, for consumer electronics, medical, telecommunications, military, automotive and industrial, and prefabrication services . The high power of the station and the efficient cooling system ensure efficient operation and reduce the time of high temperature impact on the board to a minimum. The device was designed for repairing motherboards for personal and industrial computers, graphic cards, notebooks, consoles, mobile phones, modules and car controllers made in lead-acid and lead-free soldering technology. WDS-750 soldering station allows you to control and track all device parameters on a regular basis on a touch screen LCD.

WDS-750 station specifications:
  1. Automatic outpouring, lifting and depositing of BGA systems
  2. Automatic download and BGA chips
  3. Powerful and quartz infrared IR illuminators with detachable 4 corner zones
  4. Four external temperature measurement channels with accuracy of +/- 1C
  5. 11 fixing points for PCB laminates
  6. A total of 7 sensors that control the temperature. To determine the exact temperatures in each section, precise K-type thermocouples with accuracy +/- 1C in a closed loop were used.
  7. Automatically retractable and retractable optical positioning system Split Vision 1080p 5Mpix Optical system moves X and Y axes. In addition, each of the positions of the X, Y optical system that is important for the automatic process of pouring out and distributing chips is software, i.e. editable. Additionally, for critical moments of soldering processes, it is also possible to set and save the position of the upper head, ie position Z. This BGA station model has fully configurable positions of the main moving components in the X, Y, Z axis so that they can be stored in the device memory making the soldering process still more more automated.
  8. Control of the HOTAIR upper heater and the optical joystick system as well as from the software level
  9. Three automatic modes: Weld - automatic mode of soldering the system, Remove - automatic mode of desoldering the system, Mount - full automatic mode of desoldering and positioning the system in relation to PCBs and soldering the system
  10. Full manual mode "Manual" providing full control over the process
  11. Very high power of all 6400W heating zones
  12. A large surface provided for 500x450mm PCBs
  13. Large surface of the bottom quartz heater 415x355mm
  14. Three heating zones controlled by a microprocessor 2xHOTAIR + IR (upper, lower and PCB heater) whose temperature can be controlled and controlled separately. In addition, the heating sections of the lower heater can be switched off by blocking four switches eg in the situation of heating / heating a smaller PCB. The first (top) and second (bottom) zone is the hot air blast HR. The third (bottom) is a high-performance quartz IR heater. The IR zone heats the panel over the entire surface, reducing stress and lowering the temperature needed for the correct soldering of the element
  15. The fan speed of the upper hot air heater is programmable in percentage for each of 100 profiles.
  16. LCD touch panel 7 "with microprocessor control, visualization and memory 100 solder profiles
  17. Precision vertical laser pointer built into the vacuum suction
  18. Three replaceable metal suction tips of the upper vacuum gripper for smaller (from 0.8mm) and larger systems (up to 80mm)
  19. External USB port for updating software, exporting and importing profiles, and exporting data for the completed soldering process
  20. Built-in "Alarm Record" to track device maintenance parameters
  21. Increased suction force of the vacuum gripper for lifting systems up to 80x80mm
  22. HD 15 "LCD monitor cooperating with a 5Mpix camera in 1080p resolution
  23. very efficient transverse fan automatically cooling PCB boards after desoldering and soldering. This prevents deformation of the PCB and protects the reballing effect.
  24. after each desoldering / soldering process an alarm is generated.
  25. in the event of high uncontrolled temperatures or damage to one of the fans, the programmed protection system can trigger an alarm and disconnect the heating zones.
  26. is equipped with 6 support points for the plate on each side.
  27. the possibility of exporting and importing profiles via the built-in USB port as well as exporting in the form of a csv file and bmp full data of the completed soldering process.
  28. The main PCB holder has been equipped with V-gouging which ensures quick and stable plate assembly and a large adjustment range.
  29. To direct the hot air and protect neighboring elements, magnetic nozzles were designed in the upper and lower part of the station. Nozzles are mounted very simply with one hand. They can be set and rotated at any angle.
LCD display specification:
- shows all station operation parameters in real time, including graphical visualization of the heating process status and the set and temperature reached in the graph for each of the three heating zones and each of the 4 external temperature sensors.
- the following temperatures displayed on the screen in numerical form as well as on the graph: upper HR temperature, lower HR temperature, lower IR quartz temperature, external sensor temperature 1, external sensor temperature 2, external sensor temperature 3
The soldering process is programmed from the touch screen level creating for the given:
- size and type of BGA system
- laminate parameters
- size of the hotair nozzle
- suitable soldering profile.
Each of the three heating zones can be controlled separately via 6 groups / parameter steps. Each of the groups / steps consists of three parameters:
- temperature increase per second
- final temperature values
- time of maintaining a given temperature
- thanks to the precise control of the increment and temperature values at each stage of the process, the highest standards and IPC standards are precisely defined, which precisely define the individual soldering phases of the systems, ie PREBAKE, PREHEAT, SOAK, REFLOW, COOLING.







In the case of irregularly shaped slabs, the station is equipped with 11 PCB holders which, in addition to the V-grooves, also have pins that are ideally suited for placing in the mounting holes of the boards. In order to eliminate the deflection of the plate during the soldering process, the holder has additionally two rows of brackets and the possibility of supporting directly under the brazed system (screw with adjustable height in the lower nozzle of the hotair).


The station is equipped with the Split Vision 1080p system enabling precise positioning of the system relative to the PCB pads using:
- prism system with LED backlight,
- three nanometer screws ensuring rotation of the system and PCB in every necessary plane,
- 5Mpix camera with magnification and 15 "1080p HD LCD monitor.
- additionally, the station enables automatic lifting, picking up and lowering of soldered elements on the laminate.
The station is also equipped with:
- a central laser pointer built into the vacuum gripper intended for centering the systems in relation to the upper and lower zones of hot air and the quartz heater,
- LED lighting,
- emergency switch,
- 4 sockets for external K-type temperature sensors,
- possibility of adjusting the upper and lower LED backlight of the Split Vision system independently for the system and PCB,
- external USB port for updating software, exporting and importing data and profiles.
- The station has a declaration of conformity and CE marking.
Technical data:
- total power: 6800W
- power of the upper hotair heating element: 1200W
- power of the hotair heating element: 1200W
- total power of the lower quartz heater: 4200W
- supply voltage: AC 230V / 230V 50 / 60Hz (power cable 3x2,5mm2)
- temperature sensors: sensors type K (thermocouple) with an accuracy of +/- 1C
- min. PCB size: 10x10mm
- max. PCB size: 500x450mm
- size of the lower quartz IR heater: 415x355mm
- maximum weight of the positioned system: 120g
- size of supported systems: 0.8-80mm
- thickness of supported PCB laminates: 0.5-4mm
- dimensions of the station with LCD: 960 (height) x 900 (depth) x 700mm (width)
- control: color touch screen 7 "HD HMI + PLC
- overcurrent protection: fuse with C32 characteristic.
- net weight: 100kg
- written guarantee: 24 months Door-To-Door (also for heating elements)
Set contains:
- WDS-750 soldering station with 6800W power.
- Nozzles of the upper heater (41x41mm, 36x36mm, 28x28mm, 18x18mm).
- Nozzles of the lower heater hotair (35x35mm, 50x50mm).
- Two metal suction nozzles of different diameter are screwed into the upper vacuum gripper from the silicone gripper buckets for each of them
- Spare silicone tips for the vacuum gripper.
- Thin K type thermocouple DIA = 0.127mm - 4 pcs.
- Six handles for non-standard PCBs + mounting screws.
- Additional 2 lateral holders for supporting larger PCBs.
- HD 15 "HD LCD monitor.
- instruction manual.


Product weight: 130.00 kg.
Delivery time: 1-3 working days from shiping date
Shipping cost: 483.93 EUR


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