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Main page > Repair Equipment > Soldering Equipment > BGA Rework system with LCD / Split Vision > Automatic BGA WISDOMSHOW WDS-720 4200W soldering station
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Automatic BGA WISDOMSHOW WDS-720 4200W soldering station
Automatic BGA WISDOMSHOW WDS-720 4200W soldering station with display and video system is an integrated BGA repair system. Professional and modern solution for disassembly and assembly of BGA, uBGA, BGA, CSP, SMD, micro SMD, LGA, CCGA, CBGA, CCGA, QFN, MLF, PGA systems for consumer electronics, medical, telecommunications, military and automotive electronics. The device has been designed with particular attention to small BGA elements, SMD micro-type for repairing main cell phones, all modules and controllers including those made in lead and lead-free soldering technology. A large power as well as an efficient cooling system ensures efficient work and shorten the time of interaction high temperature on the plate to a minimum.
WISDOMSHOW WDS-720 specification:
- the optical positioning system of the BGA Split Vision system,
- control of the HOTAIR upper heater both with the joystick and software level,
- three automatic work modes: Weld - automatic mode of soldering the system; Remove - automatic mode of desoldering the system; Mount - automatic mode of BGA positioning relative to PCBs and soldering of the system one half-automatic mode "Semi-Auto" and full "Manual" providing full control over the process,
- desoldering / soldering elements with sizes 1.0 - 25x25mm,
- automatic lifting and lowering of the BGA system before and after the brazing process,
- a new quieter and more precise stepper motor for the HOTAIR upper heater,
- a new, improved version of HMI software from the higher Wisdomshow BGA station models,
- high heating power of 3 temperature-controlled heating zones 4200W (hotair 2x1200W, IR 1800W),
- a large area provided for 225x315mm PCBs,
- automatically retractable and retractable CCD system,
- LCD touch panel with microprocessor control, visualization and memory of 20,000 soldering profiles,
- three interchangeable suction tips of the upper vacuum gripper for small BGA systems,
- new precision, double-sided handles for small PCBs,
- external USB port for software upgrade.
- has a 7 "LCD touch screen, large area of the bottom quartz heater 225x315mm, the possibility of programming 20,000 profiles and vertical adjustment of the bottom hotair heater (under the PCB).
- allows you to control and track all parameters on a regular basis on a 7 "LCD touch screen. The LCD display shows all the station operation parameters in real time including graphical visualization of the heating process status and the set and temperature reached on the graph for each of the 2 heating zones
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On the screen, the following temperatures are given in numerical form as well as in the chart:
- target temperature in a given step (target)
- temperature of the upper HR heater
- temperature of the lower heating element of the HR
- temperature of the lower quartz IR heater
- real temperature at the BGA system from an external sensor.
In addition, what a rare station gives separately for each of the three zones a total heating time in the range of 3 temperature intervals set by the operator - important for meeting the IPC standards.
- The station software is equipped with a KEEP profile hold button. After pressing it, the station maintains all temperatures reached by it at a given moment until the KEEP button is pressed again. The function is useful in the case of such soldering that quite reliably melts at temperatures considered suitable for the alloy.
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In order to ensure the best soldering effect in the station, there are 3 independent zones / heating surfaces whose temperature can be controlled and controlled separately by 8 temperature blocks. The first (top) and second (bottom) zone is the hot air blast HR. The third (bottom) is a quartz IR heating element. This zone heats the panel over the entire surface, reducing stress and lowering the temperature needed for the soldering of the element. Each of the three heating zones can be controlled separately via 8 groups / parameter steps. Each of the groups / steps consists of three parameters:
- temperature increase per second
- final temperature values
- time of maintaining a given temperature
Thanks to precise control of the increment and temperature values at each stage of the process, the highest standards and IPC standards are strictly defined, which precisely determine the individual soldering phases of BGA systems, ie PREBAKE, PREHEAT, SOAK, REFLOW, COOLING.
The soldering process is programmed from the touch screen level creating a suitable soldering profile for the given system and PCB specifics.
- The station is equipped with 3 support points for the plate on each side. The main PCB holder has been equipped with V-gouging which ensures quick and stable plate assembly and a large adjustment range. In the case of irregularly shaped slabs, the station is equipped with 4 double-sided PCB holders with different V-grooves.
- To direct the hot air and protect neighboring elements, magnetic nozzles were designed in the upper and lower part of the station. Nozzles are mounted very simply with one hand. They can be set and rotated at any angle. All hotair nozzles (up / down) have special side openings which blow off excess hot air.
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The station is equipped with a Split Vision system enabling precise positioning of the BGA system relative to the PCB pads using:
- laser pointer designed for centering BGA systems in relation to the upper and lower zones of hot air and quartz heater,
- prisms system with LED backlight, three nanometer screws ensuring rotation of the BGA and PCB system in every necessary plane,
- a camera with a magnification of 1080p and an LCD monitor. - To determine the exact temperatures in each section, precise K-type thermocouples with accuracy +/- 1C in a closed loop were used.
The station is also equipped with:
- LED lighting,
- emergency switch,
- a socket for an external K-type temperature sensor,
- the ability to adjust the LED illumination of the Split Vision system independently for the BGA and PCB system,
- external USB port for software update.
- The station has a certificate and CE marking.
Technical data:
- Condition: new
- Total power: 4300W
- The power of the upper hotair heating element: 1200W
- Power of the hotair heating element: 1200W
- Total power of the lower quartz heater: 1800W (2x300W + 2x600W)
- Supply voltage: AC 230V / 230V 50 / 60Hz (power cable 3x2,5mm2)
- Temperature sensor: K-type sensor (thermocouple) with an accuracy of +/- 1C
- Positioning (PCB holder): V-groove
- Min. PCB size: 0x0mm
- Max. PCB size: 260x260mm
- Size of the lower quartz IR heater: 225x315mm
- Size of supported BGA chips: 1-25mm (optional up to 50x50mm after changing hotair nozzles)
- Thickness of supported PCB laminates: 0.5-4mm
- Station dimensions with LCD: 750 (height) x 500 (depth) x 520mm (width)
- Control: color touch screen 7 "HD HMI + PLC
- Overcurrent protection: fuse with C32 characteristics
- The set also includes a 15 "1080p LCD monitor.
- Net weight: 35kg
- Written warranty: 24 months Door-To-Door (also for heating elements)
The set includes:
- WDS-720 soldering station with 4300W power.
- Nozzles of the upper heater heater (12x12mm, 14x20mm, 18x18mm).
- Main nozzle of the lower hotair heater (25x25mm).
- Three metal suction nozzles of various diameters are screwed into the upper vacuum gripper.
- Spare silicone tips for the vacuum gripper.
- K-type thermocouple
- Four handles for non-standard PCBs + mounting screws.
- 15 "1080p LCD monitor.
- manual.
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
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