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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA Stencil for Samsung Exynos 7880 / 8895B/ 9810/ 3475/ 7580/ 8895A/ 3470/ 7570 CPU-012mm
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BGA Stencil for Samsung Exynos 7880 / 8895B/ 9810/ 3475/ 7580/ 8895A/ 3470/ 7570 CPU-012mm
BGA Stencil for Samsung Exynos 7880 / 8895B/ 9810/ 3475/ 7580/ 8895A/ 3470/ 7570 CPU-012mm - the stencil can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Durable in use. High success rate of planting tin.
- Samsung Exynos 7880
- Samsung Exynos 8895B
- Samsung Exynos 9810
- Samsung Exynos 3475
- Samsung Exynos 7580
- Samsung Exynos 8895A
- Samsung Exynos 3470
- Samsung Exynos 7570
- Place of Origin: China
- Model Number: Black Reballing Stencil
- Material: Steel
- Usage: Reballing
- Color: silver
- Weight: 25g
- Operating Temperature: -50~500C
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
