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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA Stencil for HiSiliconHUAWEI HI6260/3670/3680/ + RAM80/90 CPU-0,12mm
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BGA Stencil for HiSiliconHUAWEI HI6260/3670/3680/ + RAM80/90 CPU-0,12mm
BGA Stencil for HiSilicon HUAWEI HI6260/HI3680/HI3670/80/90RAM CPU-0,12mm tin planting solder template for Hisilicon Huawei 6260 3670 3680 BGA reballing stencil.
Compatible Models:
- HiSilicon HUAWEI HI6260 v100B
- HiSilicon HUAWEI HI3670 B
- HiSilicon HUAWEI HI3680 B
- HiSilicon HUAWEI HI6260 v100A
- HiSilicon HUAWEI HI6260 v101
- HiSilicon HUAWEI HI3670/80/90RAM
Specyfication:
- Place of Origin: China
- Model Number: HU: 3, v2.0
- Material: Steel
- Usage: Reballing
- Color: silver
- Weight: 25g
- Operating Temperature: -50~500C
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Note
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