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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA Stencil for HiSiliconHUAWEI HI6260/3670/3680/ + RAM80/90 CPU-0,12mm

BGA Stencil for HiSiliconHUAWEI HI6260/3670/3680/ + RAM80/90 CPU-0,12mm

BGA Stencil for HiSiliconHUAWEI HI6260/3670/3680/ + RAM80/90 CPU-0,12mm
Price: 8,00 EUR w/o VAT

Quantity

ID: 22644

Product weight: 0.20 kg

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BGA Stencil for HiSilicon HUAWEI HI6260/HI3680/HI3670/80/90RAM CPU-0,12mm tin planting solder template for Hisilicon Huawei 6260 3670 3680 BGA reballing stencil.
 
Compatible Models:
  • HiSilicon HUAWEI HI6260 v100B
  • HiSilicon HUAWEI HI3670 B
  • HiSilicon HUAWEI HI3680 B
  • HiSilicon HUAWEI HI6260 v100A
  • HiSilicon HUAWEI HI6260 v101
  • HiSilicon HUAWEI HI3670/80/90RAM
 
Specyfication:
  • Place of Origin: China
  • Model Number: HU: 3, v2.0
  • Material: Steel
  • Usage: Reballing
  • Color: silver
  • Weight: 25g
  • Operating Temperature: -50~500C

Product weight: 0.20 kg.
Country:
Courier:
Delivery time: 10-15 working days from shiping date
Shipping cost: 6.21 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

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