Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > AMAOE BGA Mbga-U25 stencil reballing CPU HI3690v1 RAM366 RAM376 0,12mm for MBGA-B9
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AMAOE BGA Mbga-U25 stencil reballing CPU HI3690v1 RAM366 RAM376 0,12mm for MBGA-B9
- High-quality, hard steel sheet template
- Precision laser cut for better alignment
- High temperature resistant and not easy to deform
- Processor and ICs are integrated in one template
- IC numbers are laser marked on the template for reference purposes, making them much easier to find.
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NEGOTIATE PRICE
Dedicated accessories for this product
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AMAOE Mbga/MFix-UBase BGA universal reballing platform
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33.00 EUR w/o VAT |
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
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