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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > TWTK-BGAP C plaiting kit

TWTK-BGAP C plaiting kit

TWTK-BGAP C plaiting kit
Price: 8,00 EUR w/o VAT

Quantity

ID: 4293

Product weight: 0.02 kg

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TWTK-BGAP C plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

Models:
O.8-17X17,A760 CPU,6030 UEM,E708 FLASH,84VD21098-B5,IC,810 CH IC,998,V3X FLASH,SC6600A CPU,IC3,K700 UEM,V3X,V66,A620 UEM,TL-PH2,AT45DB041-CC,0V7649,A68 FLASH,2688 FLASH,84VD21098-B5,6218 CPU,IC2,IC1,C55 CPU,V70,600/800 FLASH,3310 UEM,998/V70 RAM,V66 FLASH,928/988,AIT800G,928/998/T18/T28,O.65 17X17,MT3301,MT6318,P800 RAM,998,GD92 FLASH,B08 FLASH,AP-A102 CPU,AT45DB041,8310 MF,T1108,800/600,OV7649

Photo of kit:
Product weight: 0.02 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.54 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.