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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA reballing stencils JV-RMP

BGA reballing stencils JV-RMP

BGA reballing stencils JV-RMP
Price: 79,00 EUR w/o VAT
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ID: 8360

Product weight: 0.10 kg

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BGA reballing stencils JV-RMP is set for Sony PlayStation 3 repair. Set includes 3 rework stencils to reball RSX (Reality Synthesizer), CELL/B.E. (Cell Broadband Engine) and EE+GS PS2 (emotion engine & Graphic synthesizer) using BGA balls and 4 rework stencils to reball CXD9208 GP, Si9132CBU, CXP713120 and the flash 06280W019 using the solder paste.



Package contains:
- RSX
- CELL/B.E.
- EE+GS PS2
- CXD9208 GP,
- Si9132CBU,
- CXP713120
- 06280W019
Product weight: 0.10 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.62 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

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