Soldering / silicon paste

BEST BST-328 solder paste 50g original Sn63 / Pb37 (with lead content) is "liquid tin", used for soldering small and hard-to-reach SMD components and replacing balls on BGA systems. Especially recommended and often used for GSM applications. It is used for BGAP screens, thanks to which we obtain the desired mapping of soldering fields to BGA circuits in GSM applications. The paste is also very well suited for precoating BGA pads with lead tin.

MECHANIC V4B45 solder paste is a low-temperature Sn42Bi58 solder paste with a melting point of 138 ° C. composition: Sn42 / Bi58 (42% tin, 58% bismuth), lead-free (Lead Free). This is a special type of low-melting solder paste (tin in the form of a paste) intended for soldering electronic components, i.e. SMD, BGA, e.g. in repair processes. Due to the very low melting point of exactly 138 ° C, the use of the paste in this process allows you to perform complex repairs (e.g. placing the CPU on an iPhone) without exposing the other components of the phone to damage that may result from the need to reach 217 ° C in the lead-free soldering process.

Soldering paste 35g Medium-active flux that facilitates soldering of the following elements: copper, silver-plated, zinc-coated and nickel-plated, used in the places where rosin is not sufficient.

EASY PRINT Sn62/Pb36/Ag2 40g A "No Clean" type paste is designed for soldering SMD components in production processes that do not include washing phase.

EASY PRINT Sn96,5/Ag3/Cu0,5 20gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

NOTE: Other accessories for service centers you can find in new categories:
Soldering / silicon paste, Technical lubricating oils, Rework solder liquids / gels, Cleaning fluids, Chemicals for ultrasonic cleaners, Rebailing, Soldering BGA balls
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EASY PRINT Sn96,5/Ag3/Cu0,5 40gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

Solder paste (flux) KINBO RMA-218 100g is a high quality Japanese flux no-clean designed to repair BGA, SMD, QFP. It has the consistency of a gel for easy application and has a high viscosity without leaving residues.

Flux MECHANIC UV559 10g flux solder paste is used for both general soldering as well as SMD and BGA soldering. The paste in the form of a paste is easy to apply and wash. Does not leave carbon deposits or dirt. Flux with the addition of a UV component to detect errors when applying the paste by screen printing. ORIGINAL MECHANIC UV559 is a flux with a very good price-quality ratio and a wide range of use.