Repair Tools - Thermall conductivity

AG Extreme thermal grease - 3g allows a perfect heat transfer betweenthe CPU, GPU, LED, Electrics Heatsink and chipset cooler. Ideal as a transmitter of heat from the heat pipe condenser to exchanger in a vacuum solar collector.

AG GOLD thermal grease - 1g is a high performance thermal grease .The gold content as high as 45%,the thermal conductivity is 3 times than the normal grease. It can let your CPU temperature drop about 6 degrees even if you don’t change the radiator. It’s the first choose for the overclockers.

AG Silver thermal grease - 1g is added silver compounds, use the high thermal conductivity of silver to make up the shortage of the carbon-silicon compounds. The color of the thermal grease is silver, the thermal conductivity is much higher than the common carbon-silicon compounds. Ideal as a transmitter of heat from the heat pipe condenser to exchanger in a vacuum solar collector.

Carbon Thermal Conductive Paste 1 g - Syringe
Carbon thermal conductive paste is a specialized preparation designed for heat dissipation from processors, graphics cards, and other electronic components generating high temperatures. The product is characterized by a thermal conductivity of 15.2 W/mK and a thermal impedance below 0.0008 °C?in?/W. The formulation of the preparation is based on carbon nanoparticle technology, which ensures parameter stability over long-term operation. The paste features a structure that facilitates application and complies with the requirements of the EU RoHS directive for safety and ecology.

HP Silicone Thermal Conductive Paste 100 g - Plastic Box
HP silicone paste is a thermal conductive preparation with a thermal conductivity of 1.5 W/mK, designed for efficient heat dissipation from electronic components. The product is characterized by its white color and a density of 2.1 g/cm? at 20°C. The substance maintains its operating properties over a wide temperature range from -50°C to 250°C. The preparation does not conduct electricity, which eliminates the risk of electrical damage, and demonstrates resistance to the effects of acids, bases, salts, sulfur dioxide, and ammonia.

HP Silicone Thermal Conductive Paste 500 g - Cartridge
HP silicone paste is a thermal conductive preparation with a thermal conductivity of 1.5 W/mK, designed for efficient heat dissipation from electronic components. The product is characterized by its white color and a density of 2.1 g/cm? at 20°C. The substance maintains its operating properties over a wide temperature range from -50°C to 250°C. The preparation does not conduct electricity, which eliminates the risk of electrical damage, and demonstrates resistance to the effects of acids, bases, salts, sulfur dioxide, and ammonia.

HP Silicone Thermal Conductive Paste 60 g - Cartridge
HP silicone paste is a thermal conductive preparation with a thermal conductivity of 1.5 W/mK, designed for efficient heat dissipation from electronic components. The product is characterized by its white color and a density of 2.1 g/cm? at 20°C. The substance maintains its operating properties over a wide temperature range from -50°C to 250°C. The preparation does not conduct electricity, which eliminates the risk of electrical damage, and demonstrates resistance to the effects of acids, bases, salts, sulfur dioxide, and ammonia.

HPX Silicone Thermal Conductive Paste 100 g - Plastic Box
HPX silicone paste is a thermal conductive preparation used as an intermediate layer between electronic components and heat sinks. The product is characterized by a thermal conductivity of over 2.80 W/mK and a density of 2.0 g/cm?. The material maintains its properties within an operating temperature range from -50°C to 250°C. The preparation does not conduct electricity and demonstrates chemical resistance to acids, bases, and ammonia.

HPX Silicone Thermal Conductive Paste 500 g - Cartridge
HPX silicone paste is a thermal conductive preparation used as an intermediate layer between electronic components and heat sinks. The product is characterized by a thermal conductivity of over 2.80 W/mK and a density of 2.0 g/cm?. The material maintains its properties within an operating temperature range from -50°C to 250°C. The preparation does not conduct electricity and demonstrates chemical resistance to acids, bases, and ammonia.

HPX Silicone Thermal Conductive Paste 7 g - Tube
HPX silicone paste is a thermal conductive preparation used as an intermediate layer between electronic components and heat sinks. The product is characterized by a thermal conductivity of over 2.80 W/mK and a density of 2.0 g/cm?. The material maintains its properties within an operating temperature range from -50°C to 250°C. The preparation does not conduct electricity and demonstrates chemical resistance to acids, bases, and ammonia.