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Main page > Repair Equipment > Chemical products > Rosin and flux > Flux / Solder Gel AIM NC254 for BGA 20ml
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Flux / Solder Gel AIM NC254 for BGA 20ml
Flux / Solder Gel AIM NC254 for BGA 20ml is a No-Clean flux. Flux has the consistency of a gel, is designed for the repair of electronic circuits, designed to virtually all surfaces wetted solder: solder pads, lead components. The flux can be used in the soldering point, to repair the imposition of balls BGA components. Increased wettability flux gives better results soldering. Solder connections are clear, smooth and shiny. Excellent results can be obtained either soldering soldering hand, using soldering station hot air station for repairs or reflow soldering oven.
Advantages:
- Excellent wettability
- Wide Process Window
- Compatible with the technology leaded and lead-free (lead-free)
- Used to impose balls BGA
The use of flux:
When repairing electronic systems applied flux should be limited to the repair area.
It is recommended that the application of flux with a needle, toothbrush or a cotton bud (swabs).
Temperature profile:
- Maximum temperature rise 2 ° C / second
- Stabilization and thermal activation of flux - 150 ° C - 175 ° C
- Operating temperature range flux - 155 ° C - 217 ° C
- Sample temperature profile for the SAC305 alloy containing flux NC 254 / NC257-2
Advantages:
- Excellent wettability
- Wide Process Window
- Compatible with the technology leaded and lead-free (lead-free)
- Used to impose balls BGA
The use of flux:
When repairing electronic systems applied flux should be limited to the repair area.
It is recommended that the application of flux with a needle, toothbrush or a cotton bud (swabs).
Temperature profile:
- Maximum temperature rise 2 ° C / second
- Stabilization and thermal activation of flux - 150 ° C - 175 ° C
- Operating temperature range flux - 155 ° C - 217 ° C
- Sample temperature profile for the SAC305 alloy containing flux NC 254 / NC257-2
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Note
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