Rosin and flux

Flux / Solder gel OM338 BGA 10g is a product of a reputable company Alphametals Cookson Electronics is designed for work with lead free solders and solder. It has a thin consistency by facilitates precise application and thus suited for assembly and disassembly BGA (rebate), SMD, sockets, plugs, etc. Very high efficiency. The flux under the influence of temperature becomes transparent and colorless. Flux residues can be removed with suitable cleaning agent eg. IPA. It is a flux of NO-CLEAN.

Flux Gel 1,4ml Flux gel is the condensed rosin type plux of RMA class, intended for SMT assembly and repairs. Flux gel can be applied through a sieve, pattern of from a syringe. Activators utilized in flux manufacturing process enable to leave its remnants after soldering on the package (as far as the process does not include washing phases).

Rework "no clean" - soldering help pen it's great option for repair even FBGA devices but can be used also for PLCC, QFP and BGA.
Contest: 12 cm3 L3 class soldering paste

Rosin 20g A flux with activators added to facilitate soldering; it is almost as active as soldering paste.

Solder GEL for repair - type ALPHA RMA 7 it's special gel use for resolvign problems with soldering ciruits, error's and to allow more easy soldering of SMD and DIP components. Afer use dont' need to clean.
Packed 10g of gel/10 ccm

Solder liquid flux LP-1 100ml it's special liquid used for resolve problems with soldering on ciruits. Allow more easy soldering of SMD and DIP components. Is a very active, low solids, no-clean flux.

Solder liquid flux RF 800 - 1L it's special liquid used for resolve problems with soldering on ciruits. Allow more easy soldering of SMD and DIP components. Is a very active, low solids, no-clean flux.

Solder liquid flux TK83 - 50ml it's special liquid used for resolve problems with soldering on ciruits. Allow more easy soldering of SMD and DIP components. Is a very active, low solids, no-clean flux.

Solder paste (flux) KINBO RMA-218 10g is a high quality Japanese flux no-clean designed to repair BGA, SMD, QFP. It has the consistency of a gel for easy application and has a high viscosity without leaving residues.

Flux / Solder Gel AIM NC254 for BGA 20ml is a No-Clean flux. Flux has the consistency of a gel, is designed for the repair of electronic circuits, designed to virtually all surfaces wetted solder: solder pads, lead components. The flux can be used in the soldering point, to repair the imposition of balls BGA components. Increased wettability flux gives better results soldering. Solder connections are clear, smooth and shiny. Excellent results can be obtained either soldering soldering hand, using soldering station hot air station for repairs or reflow soldering oven.