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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA stencil for iPhone 4S (JP3006)
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BGA stencil for iPhone 4S (JP3006)
BGA stencil for iPhone 4S (JP3006) is chip ball template for BGA IC after reballing.
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NEGOTIATE PRICE
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BGA stencil for iPhone 4S (JP3006)
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
