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Main page > Repair Equipment > Soldering Equipment > Soldering equipment > Dual Bracket 8in1 for Removing and Working with BGA (G3 Force)

Dual Bracket 8in1 for Removing and Working with BGA (G3 Force)

Dual Bracket 8in1 for Removing and Working with BGA (G3 Force)
Price: 35,00 EUR w/o VAT

Quantity

ID: 21776

Product weight: 0.20 kg

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Dual Bracket 8in1 for Removing and Working with BGA (G3 Force) is a high quality two-sided aluminum bracket with replaceable tips for removing BGAs. Thanks to the various sizes of flexible interchangeable tips, it is perfect for chip-off work to prevent pads from sticking.

Application:
- prevents burns when working with hotair
- perfectly suited for iPhone disassembly work
- Allows the spread of paste on the sieves with a hardened spatula at rebailing
- 8 replaceable tips in the set - including hook hooks
- Aluminum double sided handle allows for the most commonly used assembly



Usage:
Product weight: 0.20 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.67 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.