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Quick Chip 1.0 165mm
5
(6)
Quick Chip 1.0 165mm is a low-melting In & Bi brazing alloy which ,elts at 58 ° C. Applying the CHIP QUIK to the outlets, heating them with a solder leads to the formation of a low melting melt on which the SMD integrated circuits make it easy to scratch and remove the circuit from the printed circuit board.
Specification
* PbBiln adhesive
* Flux without flux
* Wire diameter 1.0 [mm]
* Wire length 165 [mm]
* Melting point 58 ° C
Instructional Video:
COMMENTS:
Before soldering a new SMD system, it is necessary to remove the solder residue with WICK tape and remove the flux residue.
Specification
* PbBiln adhesive
* Flux without flux
* Wire diameter 1.0 [mm]
* Wire length 165 [mm]
* Melting point 58 ° C
Instructional Video:
COMMENTS:
Before soldering a new SMD system, it is necessary to remove the solder residue with WICK tape and remove the flux residue.
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