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Main page > Repair Equipment > Soldering Equipment > Stencil 3D iBlack > Stencil for Universal Hard Disc Module - QianLi ToolPlus 3D iBlack
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Stencil for Universal Hard Disc Module - QianLi ToolPlus 3D iBlack
Stencil for Universal Hard Disc Module - QianLi ToolPlus 3D iBlack - the 3D feature of the Qianli Toolplus stencil makes fixing your chip much easier and 100% accurate. Enabling you to work faster and perform a perfectly precise job every time you reball a chip using these stencils.
The holes are laser-cut instead of the the industy widely used, but enviromentally demaging cutting with chemical process. The resulting tin holes on the chip are precise and well-aligned. Additionally, black color makes it easy to distinguish the tin from the stencil providing therefore convenient and easy use. These stencils also feature a 3D relief, conceived for holding the chip in place under the stencil. This helps greatly to avoid mistakes by chip movement and make the work of technician easier and more efficient.
Specyfication:
- Weight: 0.04 kg
- SKU: qianli3d-2
- Brand: QianLi
- Type: 3D IC Reballing Stencil
- Compatible Model: Universal Hard Disc Module for iPhone 6, iPhone 8, iPhone 6S
- Material: Steel
- Colour: Black
- Model: qianli3d-2
- Country/Region of Manufacture: China
- Unit Quantity: 1
- Features: 3D Recess To Allign Chip Easily For Reballing
- Design/Finish: Matte
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.
