Main page > Repair Equipment > Soldering Equipment > Platform reballing BGA > AMAOE Mbga-B18 BGA reballing platform with stencils for Qualcoom CPU Snapdragon 855/845/SDM845/SM8150/RAM556
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AMAOE Mbga-B18 BGA reballing platform with stencils for Qualcoom CPU Snapdragon 855/845/SDM845/SM8150/RAM556
Obsługiwane procesory: Qualcoom CPU Snapdragon 855/845/SDM845/SM8150/RAM556
- Mbga-U42
- M-SM8150
- M-SDM845
- Brand: AMAOE
- Model: Mbga-B18
Platform Specification:
- Setting guide line - quickly locate the placement position of the right model
- High-quality synthetic stone - resistant to high temperatures and cools down quickly
- Built-in magnet - strong magnetic force for precise positioning
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Note
1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.
2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.
3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.