Solder tin

BEST BST-328 solder paste 50g original Sn63 / Pb37 (with lead content) is "liquid tin", used for soldering small and hard-to-reach SMD components and replacing balls on BGA systems. Especially recommended and often used for GSM applications. It is used for BGAP screens, thanks to which we obtain the desired mapping of soldering fields to BGA circuits in GSM applications. The paste is also very well suited for precoating BGA pads with lead tin.

Low melting tin with flux Sn42Bi58 1.5mm / 100g- low temperature, lead free with flux. Tin alloy with a melting point of 138 ° C.

LOW-FLAVOR TIN Sn42Bi58 138C/1mm/100g- low temperature, lead free with flux. Tin alloy with a melting point of 138 ° C.

Low-melting point tin Bi57Sn42Ag1 - 0.70mm / 25g solder (57% bismuth, 42% tin, 1% silver) is manufactured from primary raw materials in their first melt. It has a low melting temperature, making it suitable for soldering devices and components that are sensitive to damage from higher temperatures when using conventional solders. It features excellent wettability and fast flow. The alloy complies with the ROHS directive (2002/95/EC).

Low-melting point tin Bi57Sn42Ag1 - 1,25mm / 25g solder (57% bismuth, 42% tin, 1% silver) is manufactured from primary raw materials in their first melt. It has a low melting temperature, making it suitable for soldering devices and components that are sensitive to damage from higher temperatures when using conventional solders. It features excellent wettability and fast flow. The alloy complies with the ROHS directive (2002/95/EC).

Solder S-Sn60Pb40-SW26 (LC60) Q 0.25 100g is solder manufactured in the first melt of tin and lead according to PN EN 29453:2000 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence.

Solder S-Sn60Pb40-SW26 (LC60) Q 0.50 100g is solder manufactured in the first melt of tin and lead according to PN EN 29453:2000 standard in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence.

Solder SAC 0307 S-Sn99Ag03Cu07-1.1.3/0.56 100g is S-Sn99Ag0,3Cu0,7 solder manufactured in the first melt of tin, silver and copper in continuous casting process in air-free environment; afterwards extruded, in order to eliminate oxide occurrence. Designed as an economical replacement for the solder alloy Sn63Pb37, consistent with the guidelines of the RoHS Directive. Specially selected trace elements of metals improves dispersed, weld appearance and protect against rapid oxidation during the soldering process.