Soldering paste

MGChemicals MG8341No Clean flux paste in syringe dispenser 10mlThis is our absolute favourite flux. We find compared to anything else, it lasts the longest, and doesn’t “gum up” from the heat of your soldering iron like so many others. This means less time cleaning flux only to have to apply more. This is a great all-round flux, and is perfect for surface mount, through hole, hand soldering, and IR/hot air rework. MG Chemicals #8341 features a unique mixture of high grade synthetic resin and thixotropic agents designed specifically for use with high temperature lead free and conventional Sn/Pb alloys.

BEST BST-328 solder paste 50g original Sn63 / Pb37 (with lead content) is "liquid tin", used for soldering small and hard-to-reach SMD components and replacing balls on BGA systems. Especially recommended and often used for GSM applications. It is used for BGAP screens, thanks to which we obtain the desired mapping of soldering fields to BGA circuits in GSM applications. The paste is also very well suited for precoating BGA pads with lead tin.

EASY PRINT Sn62/Pb36/Ag2 40g A "No Clean" type paste is designed for soldering SMD components in production processes that do not include washing phase.

EASY PRINT Sn96,5/Ag3/Cu0,5 20gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

NOTE: Other accessories for service centers you can find in new categories:
Soldering / silicon paste, Technical lubricating oils, Rework solder liquids / gels, Cleaning fluids, Chemicals for ultrasonic cleaners, Rebailing, Soldering BGA balls
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EASY PRINT Sn96,5/Ag3/Cu0,5 40gPaste designed for soldering SMD components in production process that do not include washing phase. It is based on a "no clean" flux type, that does not require cleaning and residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humaidity and temperature.

Jelly oil - 50ml

Silicon Oil - 50ml

Solder paste (flux) KINBO RMA-218 100g is a high quality Japanese flux no-clean designed to repair BGA, SMD, QFP. It has the consistency of a gel for easy application and has a high viscosity without leaving residues.

Soldering paste 100g Medium-active flux that facilitates soldering of the following elements: copper, silver-plated, zinc-coated and nickel-plated, used in the places where rosin is not sufficient.

Thermally Conductive Adhesive Termoglue - 10g a great way to secure the radiators to e.g. memory chips, transistors or bridges. The connection thus created is super strong and has excellent heat transfer characteristic.