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Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > BGA Planting Kit for Siemens series x65, x7x

BGA Planting Kit for Siemens series x65, x7x

BGA Planting Kit for Siemens series x65, x7x
Price: 14,00 EUR w/o VAT

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ID: 1784

Product weight: 0.02 kg

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BGA Planting Kit for Siemens series x65, x7x it's proffesional stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone. List of supported phones: A70, A75, AX75, C75, CX75, M75, Siemens CX70, Siemens X65 - np. A65, C65, CV65, CT65, CF65, CX6C, CX65, CXV65, S65, SV65, SL65, M65, MV65 and similar...
Product weight: 0.02 kg.
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Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.54 EUR

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Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.