BGA Techot TH-W430 2x Hot Air Soldering Station

BGA Techot TH-W430 2x Hot Air Soldering Station is a modern and professional tool for precision soldering of BGA, PBGA, PLCC ... and wherever high precision is required. The easy-to-use touch screen control panel has a large heating surface and a handle for mounting larger PCBs and a three-component heating system.

Specifications:
Total power 4800W
- Top heating Hot air 800W
- Underfloor heating Second hot air 1200W, third IR 2700W
- Power supply AC220V ± 10 50 / 60Hz
- Dimensions of the device 600x600x530mm
- PCB Positioning V-grooving, PCB support adjustable in all directions using an external universal holder
- Temperature control (Sensor K) operating closed loop, independent heating of each heating zone.
- Dimensions of the heater 200x320mm
- PCB Max size 330 × 350mm Min 22 × 22 mm
- BGA size Min 2x2 mm Max 80 × 80 mm
- Electronics High-temperature temperature control module, built-in industrial computer



Specification

• The device has a touch panel and microprocessor control. Four temperature charts are displayed on the monitor at any time so that the temperature error can be controlled within 3 degrees.
• The device is designed to work with large main boards made with both lead and unleaded solder technology. High power and efficient cooling system ensures efficient operation and reduces the time of high temperature impact on the plate to the minimum necessary.
• Each brazing profile has 8 temperature sections. An excellent temperature control system ensures brazing performance.
• The stations have a profile support button. When activated, the heater maintains the temperature set by the controller until it is released after the next press.
• Can save multiple temperature profiles. It can analyze charts and change settings on the touch panel at any time.
• There are three independent heating surfaces. The first and second are the hot air and the third are the quartz heating elements. The first and second heating surfaces can be controlled by multiple groups and sections of temperature parameters. The upper heating element (power: 800W) is adjustable in every plane, the lower power (1200W) gives the height adjustment. The third surface (power: 2700W) heats the plate on a large surface, reducing the stresses and lowering the temperature required for proper soldering of the element.
• Mounting of the panel is done using specially-pryed mounting rails or irregular plates with max dimensions: 350 × 330mm, min: 20x20mm.
• A highly selectable K-type high temperature sensor operating in closed loop to accurately determine upper and lower temperature.
• Specially designed magnetic nozzles are mounted immediately, giving the possibility of adjusting at any angle. They are equipped with special openings whereby the air is discharged so that we do not blow out the elements near the solder system.
• The adjustment of the upper cylinder in three planes guarantees the ideal positioning of the blow over the solder in the three planes XYZ.
  4.8 kW heater power ensures that the device can handle even the largest circuits.
• A strong transverse fan automatically cools the PCB after desoldering and soldering, can prevent PCB deformation and protect the reballing effect.
• After the desoldering and soldering is completed, an alarm is generated. When the temperature is out of control, the electrical circuit can be automatically cut off by means of an over temperature protection system.
• The stations have a profile support button. When activated, the heater maintains the temperature set by the controller until it is released after the next press.
• Built-in vacuum pump and external vacuum evacuator for easy BGA pick-up.
• The station has CE, emergency stop as well as double protection to protect the board from overheating.