RBX platform set for reballing BGA UFS/eMMc/eMCP

RBX platform set for reballing BGA UFS/eMMc/eMCP is a complete set for cleaning BGA systems and preparing them for reballing. Easy and fast method of placing solder balls on BGAs. RBX includes a set of sieves enabling quick and easy application of balls to BGA eMMC, eMCP and UFS components. Durable design with TecaForm and aluminum alloy makes it easy to remove excess balls. Perfectly matching the templates to the base guarantees full adhesion of the balls to the systems. RBX has been adapted to work with the Jovy iRework water heater. It optimizes work during the whole reballing process.

• material: TecaForm + brushed aluminum
• eMMC / eMCP / UFS support in frames:
  - BGA 153 (eMMC / UFS),
  - BGA 169 (eMMC),
  - BGA 162 (eMMC),
  - BGA 169 (eMMC)
  - BGA 186 (eMMC),
  - BGA 221 (eMCP),
  - BGA 529 (eMCP),
  - BGA 254 (UFS),
  - BGA 95 (UFS)
• support for sizes:
  - 10 x 11
  - 11.5 x 13
  - 12 x 16
  - 12 x 18
  - 14 x 18
  - 15 x 15

• thickness - up to 0.6mm and up to 1mm

• RBX platform and set of two aluminum templates 0.6mm / 1mm for cleaning BGA systems:

• a set of six sytems for various sizes of systems:

• a set of 8 sieves made of stainless steel:

• RBX platform
• set of two aluminum templates 0.6mm / 1mm for cleaning BGA systems
• a set of six sytems for various sizes of systems
• a set of 8 sieves made of stainless steel
• Gootwick (braid)
• ESD brush
• flux in a pen
• platform packed in a zippered case