Stencil BGA kit
22574 |
BGA Stencil for Samsung Exynos 7885RAM/9820/9610RAM/7885CPU/980/9610CPU-012mm BGA Stencil for Samsung Exynos 7885RAM/9820/9610RAM/7885CPU/980/9610CPU-012mm the stencil can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Durable in use. High success rate of planting tin. |
17159 |
BGA Stencil Kit 570 pcs + accessories BGA Stencil Kit 570 pcs + accessories BGA stencil are made of steel, ensures no deformation during BGA reballing process. Stencil without frame, are used during direct heating and not require additional mounting brackets or frames. |
1874 |
BGA TWTK-BGAP-25 plaiting kit it's a 25 set matrix for that's needed tool when you have to exchange BGA parts of your phone. It's supports Nokia chipset as 3210/8850/8810/8210 IC, 3310/8210 MD, 8210 IC, 6210 IC, 8810 CPU, 3220 MF, 6230 RAM, 3220 CPU, 7250 CPU, 7250/7200 Flash, 7610/7260 UEM, 3220 Flash, 3100 CPU, 6230 UEM, 6230 Blue EarPhone, 6230 CPU, 8310/6230 Flash, 3310/3210/8850/8210 CPU, 8310 IC, 6230 CPU. Click to link for bigger photo - LINK |
8700 |
BGAP for iPhone 4g 3gs 3g plaiting kit BGAP for iPhone 4g 3gs 3g plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
9077 |
Complete set of 353 pcs BGA stencils for uBGA 90x90 Complete set of 353 pcs BGA stencils for uBGA 90x90 it's a proffesional set of 353 pcs of 0,3mm stencils 90x90mm for working with CPU, GPU, PS3, Xbox, etc. |
8572 |
Complete set of 353pcs BGA stencils for uBGA + JIG table Complete set of 353 pcs BGA stencils for uBGA + JIG table it's a proffesional set of 353 pcs of 0,3mm stencils 90x90mm for working with CPU, GPU, PS3, Xbox, etc. and proffesional uBGA table that allows to place balls using stencils very easily and without any demage of chip. |
22200 |
Mechanic 3D-X stencils for iPhone X A12 PCB Mechanic 3D-X stencils for iPhone X A12 PCB allows easily rebailing of iPhone X board |
5666 |
Reballing Kit Jovy - JV-RMS it's set of proffesionally maked plates that comes with two additional modules - A and B, Module A it's source to control IC from up and down and position it correct. Module B are for prorection plates as well to avoid movement while working. It's high quality of tools for proffesionalls. |
21668 |
Set of 4 stencil for Direct BGA eMMC / eMCP (153/169, 162, 221, 529) Set of 4 stencil for Direct BGA eMMC / eMCP (153/169, 162, 221, 529) is a complete set of stencils to rebailing BGA memory eMMC / EMCP chips found in phones and tablets. Set cover 99% phones models available on market. |
21690 |
Stencil Direct BGA for eMMC 153/169 Stencil Direct BGA for eMMC 153/169 is used for rebailing BGA memory eMMC chips found in phones and tablets. |
8568 |
Complete set of 49 pcs BGA stencils for uBGA Complete set of 49 pcs BGA stencils for uBGA it's a proffesional set of 49 pcs of 0,3mm stencils 80x80mm for working with CPU, GPU, etc. |
8660 |
Complete set of 20 pcs BGA stencils for Xbox 360/PS3/Wii Complete set of 20 pcs BGA stencils for Xbox 360/PS3/Wii it's a proffesional set of 20 pcs of 0,3mm stencils 90x90mm for working with CPU, GPU for xbox360, PS3 and Wii. you will not longer got problems with rebailing such CPU as XB360HAHA 0.60mm, PS3-CPU 0.60mm, CXD2976GB 0.60mm |
15899 |
Large stencil BGA Kit 388 pcs 80x80 79x79 Large stencil BGA Kit 388 pcs 80x80 79x79 with this set possible is place BGA balls on IC chip that you can found in laptops and game consoles. |