Stencil BGA kit

Platform BGA QianLi iP-02 Middle Frame Reballing for iPhone 11 / Phone 11 Pro this device is a specialist tool that gives the user the ability to reball (re-solder) the middle layer of logic boards on some iPhone Models. It holds the logic board perfectly in place and is heat resistant allowing the user to use a hot air gun and the included stencil to reball the middle layer of the logic board.

Stencil Direct BGA for eMMC 529 is used for rebailing BGA memory eMMC / EMCP chips found in phones and tablets.

Stencil for A7 CPU - QianLi ToolPlus 2D iBlack stencil facilitate mounting the system. They enable faster work and precise rebailing.
The holes are laser cut. The resulting holes are therefore precise and well matched. In addition, the black color makes it easier to distinguish the layout from the template, making it convenient and easy to use.

Stencil for iPhone 5/5s - QianLi 2D iBlack Communication Base Band Module stencil facilitate mounting the system. They enable faster work and precise rebailing.
The holes are laser cut. The resulting holes are therefore precise and well matched. In addition, the black color makes it easier to distinguish the layout from the template, making it convenient and easy to use.

Stencil for Universal Hard Disc Module GTR100- QianLi ToolPlus 2D iBlackstencil facilitate mounting the system. They enable faster work and precise rebailing.
The holes are laser cut. The resulting holes are therefore precise and well matched. In addition, the black color makes it easier to distinguish the layout from the template, making it convenient and easy to use.

TWTK-BGAP A Sieries plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

TWTK-BGAP C plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

TWTK-BGAP-20 in 1 for SE plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

TWTK-BGAP-40 in 1 for Nokia plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.

TWTK-BGAP-55 in 1 Motorola plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone.