Stencil BGA kit
22523 |
Platform BGA QianLi iP-02 Middle Frame Reballing for iPhone 11 / Phone 11 Pro Platform BGA QianLi iP-02 Middle Frame Reballing for iPhone 11 / Phone 11 Pro this device is a specialist tool that gives the user the ability to reball (re-solder) the middle layer of logic boards on some iPhone Models. It holds the logic board perfectly in place and is heat resistant allowing the user to use a hot air gun and the included stencil to reball the middle layer of the logic board. |
21689 |
Stencil Direct BGA for eMMC 162 Stencil Direct BGA for eMMC 162 is used for rebailing BGA memory eMMC chips found in phones and tablets. |
21692 |
Stencil Direct BGA for eMMC 529 Stencil Direct BGA for eMMC 529 is used for rebailing BGA memory eMMC / EMCP chips found in phones and tablets. |
21691 |
Stencil Direct BGA for eMMC/eMCP 221 Stencil Direct BGA for eMMC/eMCP 221 is used for rebailing BGA memory eMMC / EMCP chips found in phones and tablets. |
22407 |
Stencil for A7 CPU - QianLi ToolPlus 2D iBlack Stencil for A7 CPU - QianLi ToolPlus 2D iBlack stencil facilitate mounting the system. They enable faster work and precise rebailing. |
22406 |
Stencil for iPhone 5/5s - QianLi 2D iBlack Power Logic Module Stencil for iPhone 5/5s - QianLi 2D iBlack Power Logic Module stencil facilitate mounting the system. They enable faster work and precise rebailing. |
22404 |
Stencil for iPhone 5/5s - QianLi 2D iBlack Communication Base Band Module Stencil for iPhone 5/5s - QianLi 2D iBlack Communication Base Band Module stencil facilitate mounting the system. They enable faster work and precise rebailing. |
22319 |
Stencil for reballing MTK procesors A422 Stencil for reballing MTK procesors A422 allow reballing of 13 models procesors. |
22408 |
Stencil for Universal Hard Disc Module GTR100 - QianLi ToolPlus 2D iBlack Stencil for Universal Hard Disc Module GTR100- QianLi ToolPlus 2D iBlackstencil facilitate mounting the system. They enable faster work and precise rebailing. |
4311 |
TWTK-BGAP 8in1 plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
4295 |
TWTK-BGAP A Sieries plaiting kit TWTK-BGAP A Sieries plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
4291 |
TWTK-BGAP B plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
4293 |
TWTK-BGAP C plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
4298 |
TWTK-BGAP-18 in 1 MTK plaiting kit TWTK-BGAP-18 in 1 MTK plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
4303 |
TWTK-BGAP-20 in 1 for SE plaiting kit TWTK-BGAP-20 in 1 for SE plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
4292 |
TWTK-BGAP-30 in 1 SE plaiting kit TWTK-BGAP-30 in 1 SE plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
4296 |
TWTK-BGAP-40 in 1 for Nokia plaiting kit TWTK-BGAP-40 in 1 for Nokia plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
4294 |
TWTK-BGAP-41 in 1 Samsung plaiting kit TWTK-BGAP-41 in 1 Samsung plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
4304 |
TWTK-BGAP-55 in 1 Motorola plaiting kit TWTK-BGAP-55 in 1 Motorola plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |
4302 |
TWTK-BGAP-58 in 1 for Nokia plaiting kit TWTK-BGAP-58 in 1 for Nokia plaiting kit it's a matrix for that's needed tool when you have to exchange BGA parts of your phone. |