4,8 RATING:
Purchase satisfaction
95,0%
Customer service
94,2%
Shop offer
92,9%

Cart

0 products
Main page > Repair Equipment > Soldering Equipment > Stencil BGA kit > MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X

MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X

MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X
Price: 18,00 EUR w/o VAT

Quantity

ID: 22898

Product weight: 0.30 kg

Add to store products

Ask for product

 
MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X
 
1. The stepped grooves can quickly adjust the tin sweating location of IC beads.
2. The square hole position makes the tin bead form easier to remove.
3. No matter new or professional, this 4D Reballing Solder is easy to handle.
4. Uniform heating, easy deformation and long service life.
5. The success rate of Stencil Tin is high, and after being started, it is basically formed once.
  • semi carving groove
  • auto positioning
  • design the leakproof of tin
  • remove the stencil with planting 
 
Specification:
  • Supported phones: Apple iPhone X
  • Weight: 0.06 kg
  • Manufacturer: MECHANIC
  • Size single stencil: 7,6*4,8cm and 4,7*6,7mm

Set contains:
2 pcs of sieves with dimensions: 7.6 * 4.8cm and 4.7 * 6.7mm and a protective packaging
Product weight: 0.30 kg.
Country:
Courier:
Delivery time: 14-28 working days from shiping date
Shipping cost: 9.59 EUR

NEGOTIATE PRICE

PDF
If you are interested in MECHANIC BGA reballing stencil 4D-X grooved with leakproof for iPhone X you will probably want to take a look at following products:

You might also be interested in:

BGA stencil for iPhone 5S (P3025) + BGA stencil for iPhone 5S (P3025) more
Price:
6.00 EUR w/o VAT
AMAOE BGA Mbga-U25 stencil reballing CPU HI3690v1 RAM366 RAM376 0,12mm for MBGA-B9 + AMAOE BGA Mbga-U25 stencil reballing CPU HI3690v1 RAM366 RAM376 0,12mm for MBGA-B9 more
Price:
7.00 EUR w/o VAT
MEGA-IDEA Black Stencils MSM8916 8928 MT6952 CPU For Redmi NOTE | Redmi 2 |2A + MEGA-IDEA Black Stencils MSM8916 8928 MT6952 CPU For Redmi NOTE | Redmi 2 |2A more
Price:
9.00 EUR w/o VAT
TWTK-BGAP-58 in 1 for Nokia plaiting kit + TWTK-BGAP-58 in 1 for Nokia plaiting kit more
Price:
8.00 EUR w/o VAT
BGA stencil for Samsung Galaxy S4 (i9505) + BGA stencil for Samsung Galaxy S4 (i9505) more
Price:
6.20 EUR w/o VAT
AMAOE BGA Mbga-U23 stencil reballing CPU SM6150 MSM8909 MT6761/6762/6765 for MBGA-B8 + AMAOE BGA Mbga-U23 stencil reballing CPU SM6150 MSM8909 MT6761/6762/6765 for MBGA-B8 more
Price:
7.00 EUR w/o VAT
MEGA-IDEA Black Stencils SDM 660 CPU for Oppo R11 Series|VIVOX20|MI|NOTE3 + MEGA-IDEA Black Stencils SDM 660 CPU for Oppo R11 Series|VIVOX20|MI|NOTE3 more
Price:
9.00 EUR w/o VAT
MEGA-IDEA Black Stencils MSM8974 8274 8674 CPU for MI4 Series MI3 |3S |NOTE + MEGA-IDEA Black Stencils MSM8974 8274 8674 CPU for MI4 Series MI3 |3S |NOTE more
Price:
9.00 EUR w/o VAT

Note

1. Offered by us accessories and replacement parts are not original phone producer parts, but they have been carefully choosen from list of producers to offer highest quality.

2. Our company sale only hardware/HASP/Box - not software for it. Software can be found and downloaded directly from producers webpage.

3. All trademarks mentioned on this site are property of their respective companies. Including product names, logos, commercial symbols, trade names and slogans are trademarks of those respective or related companies, and are protected by international trademark laws, and they are used here only for information purpose.